The HG23 series silver pastes are designed for high-dielectric-constant, low-loss ceramic capacitors, applied as two-sided printed silver electrodes. After high-temperature sintering, the silver layer forms a stable and reliable electrode, followed by lead soldering and an outer coating of magnetic paint or epoxy resin for encapsulation.

Our company offers silver pastes with 55–70% silver content, providing excellent solderability, good printability, stable adhesion, and long-term durability, making them suitable for demanding electronic and power applications.

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Product Features

• Excellent printability with no screen clogging

• Strong adhesion to ceramic substrates

• Non-stick behavior after sintering (no chip adhesion)

• Good solderability and soldering heat resistance

• Superior electrical conductivity and stable electrode performance

• Suitable for high-temperature sintering processes

 

Primary Applications

The HG23 series silver pastes are mainly used in:

• Ceramic capacitors (MLCC, chip capacitors, etc.)

• Electronic component electrode printing

• Power transmission and distribution equipment

• Power modules for pulse-energy processing

• High-voltage and high-reliability capacitor products