The HG10 series is a single-component, thermally curable, epoxy-based conductive silver adhesive designed for LED and IC die-attach applications. It supports high-speed dispensing and dipping processes, ensuring smooth application without tailing, stringing, or splashing.

It delivers strong and stable bonding performance on various lead frame materials, including Ag-plated frames, copper frames, PPF frames, ceramic lead frames, as well as FR-4 PCB substrates, effectively enhancing the reliability of semiconductor devices.

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Product Features

• High electrical conductivity

• High thermal conductivity for efficient heat dissipation

• Excellent bonding strength and long-term reliability

• Compatible with automated dispensing and die-attach processes

• Stable residual adhesive pattern to improve device performance

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Primary Applications

• Integrated circuits (IC)

• Consumer electronics assemblies

• MEMS sensors

• Camera modules

• LED packaging