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This product can be used on silver or other soldering alloys in liquid form which its melting point is up to 1800 ℉. It is designed to be used in low temperature, longer or uneven heating process. The performance is still good under different operating environments. We recommend you to use this product apply to solder of stainless steel and copper alloys. Under the conditions of lower or higher temperature, or longer heating time, it can help to change the fluidity of alloy, remove adhesion and oil stain. This product conforms to the international standards, and available in powder or paste forms. Package of 1 kg or 30 kg barrel are provided.